With a focus on developing computational algorithms for examining waveform design in diverse active sensing applications, this guide is ideal for researchers and practitioners in the field. The three parts conveniently correspond to the three categories of desirable waveform properties: good aperiodic correlations, good periodic correlations and beampattern matching. The book features various application examples of using the newly designed waveforms, including radar imaging, channel estimation for communications, an ultrasound system for breast cancer treatment and covert underwater communications. In addition to numerical results, the authors present theoretical analyses describing lower bounds or limitations of performance. Focusing on formulating practical problems mathematically and solving the mathematical problems using efficient and effective optimization techniques, the text pays particular attention to developing easy-to-use computational approaches. Most algorithms are accompanied by a table clearly detailing iteration steps and corresponding MATLAB codes are available on the companion website.
Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.<br> <br> Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service management shows you step-by-step how to: <br> * Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost <br> * Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data <br> * Identify potential failure modes, sites, mechanisms, and architecture-stress interactions--PLUS appropriate measures you can take to reduce, eliminate, or accommodate expected failures <br> * Characterize materials and processes by the key controllable factors, such as types and levels of defects, variations in material properties and dimensions, and the manufacturing and assembly processes involved <br> * Use experiment, step-stress, and accelerated methods to ensure optimum design before production begins<br> <br> <br> Detailed design guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage. Detailed guidelines for substrate...wire and wire, tape automated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometric configurations of package elements, manufacturing and assembly conditions, materials selection, and loading conditions--round out this guide's comprehensive coverage.<br> <br> of related interest...<br> <br> PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, Robert Hannemann and Michael Pecht<br> <br> For the professional engineer involved in the design and manufacture of products containing electronic components, here is a comprehensive handbook to the theory and methods surrounding the assembly of microelectronic and electronic components. The book focuses on computers and consumer electronic products with internal subsystems that reflect mechanical design constraints, cost limitations, and aesthetic and ergonomic concerns. Taking a total system approach to packaging, the book systematically examines: basic chip and computer architecture; design and layout; interassembly and interconnections; cooling scheme; materials selection, including ceramics, glasses, and metals; stress, vibration, and acoustics; and manufacturing and assembly technology. 1994 (0-471-53299-1) pp.<br> <br> SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht<br> <br> This comprehensive, fundamentals first handbook outlines the soldering methods and techniques used in the manufacture of microelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes and classification; the material dynamics of heat soldering when assembling differing materials; wave and reflow soldering; controlling contamination during manufacturing cleanings; techniques for assuring reliability and quality control during manufacturing; rework, repair, and manual assembly; the modern assembly / repair station; and more. The book also provides clear guidelines on assembly techniques as well as an appendix of various solder equipment manufacturers.<br> <br> 1993 (0-471-59167-X) 312 pp.
The Advanced Reader series is designed for children in the 2nd and 3rd grades as they improve their reading skills. This book, "Amazing Dinosaurs" is filled with fascinating facts and photos of God's creation, and will increase your child's love for reading and for his Creator.
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